Current Electronics utilizes the advanced Gold-Place^TM L60 Automated Pick & Place System performing surface mount board assembly ideal for small to medium size production. Integrating digital linear scale encoders and automatic fiducial recognition, precision placement is ensured producing a superior quality product.

Impressive capability:
• Placement accurate to 1mil
• 15mil pitch capable
• 0201 components
• Large boards 12" x 12"

Our engineers and operators are trained by the manufacturer to provide assemblies at the highest standard possible.

 

The Gold-Print^TM SPR-45 Automatic Stencil Printer produces accurate and repeatable solder paste application. The dual squeegee with individual pressure control gives us high precision fine pitch printing ability.

 

Finally the Gold-Flow^TM Batch Reflow Oven with 100% forced air convection enables a higher throughput than standard batch ovens. Using a unique shuttle system, while one board is being processed, another board can be cooled and offloaded, then a third board can be loaded and shuttled into the chamber for reflow.