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Production SMT Assembly

L60

 

Current Electronics utilizes the advanced Gold-PlaceTM L60 Automated Pick & Place System performing surface mount board assembly ideal for small to medium size production. Integrating digital linear scale encoders and automatic fiducial recognition, precision placement is ensured producing a superior quality product.

    Impressive capability:
  • Placement accurate to 1mil
  • 15mil pitch capable
  • 0201 components
  • Large boards 12" x 12"

Our engineers and operators are trained by the manufacturer to provide assemblies at the highest standard possible.

Paste

 

The Gold-PrintTM SPR-45 Automatic Stencil Printer produces accurate and repeatable solder paste application. The dual squeegee with individual pressure control gives us high precision fine pitch printing ability.

 

Reflow

 

Finally the Gold-FlowTM Batch Reflow Oven with 100% forced air convection enables a higher throughput than standard batch ovens. Using a unique shuttle system, while one board is being processed, another board can be cooled and offloaded, then a third board can be loaded and shuttled into the chamber for reflow.

 

Current Electronics has taken the extra step of investing in new, entirely
lead-free equipment allowing us to guarantee ROHS compliance.

ROHS

   
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